The MPPC employes through-hole electrodes called TSV (through-silicon via). Since no electrode space for wire bonding is needed, the gap (between the package edge and the MPPC photosensitive area) around the outer periphery is reduced to 0.2 mm on the four sides, allowing a four-side buttable arrangement.
The product is optimized for medical imaging and high-energy particle detection requiring photon counting measurement, as well as other applications involving low-light-level detection.
Reduced crosstalk (compared to previous products)
COB (chip on board) package with minimal dead space
Tiling forms a large sensitive area