EM TIC 3X Ion Beam Milling System
Leica Microsystems EuropeThe Triple Ion Beam Cutter, EM TIC 3X allows production of cross sections of hard/soft, porous, heat sensitive, brittle and heterogeneous material for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.















![eXtended Performance [XP] 2.5 µm Columns - Waters - Separations](https://cdn.sanity.io/images/f5b6mtfn/selectscience-prod/af546f94a9c78b370af655c76755e034ee4aa081-250x162.jpg?w=3840&q=75&fit=clip&auto=format)







