Heat Sealing Foil, solvent resistant, peelable.
Heat sealing offers a 100% effective method of plate sealing, for complete seal integrity, as well as being quick and cost effective.
The solvent resistance of this seal enables its use for low and room temperature compound storage in Dimethyl Sulfoxide (DMSO) and organic solvents. 100% DMSO can be stored at room temperature for 12 months without deterioration of the seal.
It forms a weld seal to Polyethylene plates and cannot be peeled off. Access is by piercing using a blade or needle. It can be removed from polypropylene and COC plates by peeling and can be peeled directly from a plate immediately after removal from a freezer.
Also available in roll format for high-throughput and automation.