HORIBA launches Partica particle size and shape analyzer
New instrument supports advanced materials research and quality control with faster, high-precision analysis
7 Aug 2026
Partica particle size and shape analyzer
HORIBA has launched Partica™, a laser diffraction and dynamic imaging particle size and shape analyzer designed to support research and development and quality control for advanced materials.
Partica combines particle size distribution measurement and particle shape analysis in a single instrument, delivering results in approximately one minute. According to HORIBA, the system can reduce measurement time by as much as 50% compared with the company's conventional models, depending on application and operating conditions.
The analyzer is designed for industries where particle size and shape directly affect product performance, including semiconductors, battery materials, pharmaceuticals, catalysts and other advanced materials. Accurate particle measurement is critical for product development, manufacturing efficiency and quality assurance in these sectors.
Building on HORIBA's existing particle analysis technology, Partica offers high-precision measurements across a wide particle size range.
HORIBA also redesigned the software platform to improve usability, scalability and workflow efficiency. New capabilities include remote operation, automation functions and support for data integrity requirements, helping customers streamline laboratory and manufacturing processes.
Key markets and applications
Energy and Environment
- Catalysts: Research and development of new materials and quality control in production processes.
- Battery materials: Material development and manufacturing quality control.
Bio and Healthcare
- Bio/Life sciences: Research involving antibody therapies, cells and related technologies.
- Pharmaceuticals and Cosmetics: Development and quality control of synthetic medicines, powders and coatings.
- Food and Beverages: Research, product development and quality control for flavor, texture and shelf-life management.
Materials and Semiconductor
- Semiconductor materials: Production management of adhesives and chemical mechanical polishing (CMP) slurries for semiconductor wafers.
- Chemical industry: Research, development and quality control of powders, coatings, granulated products and synthetic compounds.
- Precision machinery: Material development for multilayer ceramic capacitors, printing inks and related products.
Tetsuya Mori, global product line manager at HORIBA Ltd, said, "With nearly 40 years of experience in the particle size analyzer market, HORIBA developed Partica to address evolving customer needs. The system supports applications such as analyzing pharmaceutical particle characteristics that affect absorption efficiency and accelerating evaluation of powder fluidity, which influences production performance."
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Frequently asked questions
What is the HORIBA Partica particle size and shape analyzer and how does it improve measurement efficiency?
Partica is a HORIBA laser diffraction and dynamic imaging particle size and shape analyzer for R&D and quality control of advanced materials. It combines particle size distribution and particle shape analysis in one instrument, delivering results in about one minute and reducing measurement time by up to 50% compared with HORIBA’s conventional models, depending on the application and operating conditions.
Which industries and applications benefit most from the HORIBA Partica analyzer?
HORIBA’s Partica targets sectors where particle size and shape affect product performance, including semiconductors, battery materials, pharmaceuticals, catalysts and other advanced materials. Key applications span energy and environment (catalysts, battery materials), bio and healthcare (life sciences, pharmaceuticals, cosmetics), food and beverages, materials and semiconductor manufacturing, chemical industry products and precision machinery materials.
What software and workflow features does HORIBA Partica offer for laboratory and manufacturing environments?
Partica builds on HORIBA’s particle analysis technology with high-precision measurements across a wide particle size range and a redesigned software platform. The software improves usability, scalability and workflow efficiency, offering remote operation, automation functions and support for data integrity requirements. These capabilities help streamline laboratory and manufacturing processes, including quality control and production management for advanced material applications.