Mechanical characterization of ultra-low-k dielectric films

To minimize the size of a microelectronic device and maximize its operating frequency, the device’s components must be separated by a material with a dielectric constant as low as possible. A class of materials known as ultra-low-k (ULK) dielectrics are employed for this purpose. In this application note, Bruker Nano discusses how mechanical reliability monitoring of ULK films is becoming increasingly important to rapidly identify process variation and sustain high device yields; and how nanoindentation and nanoscratch testing provide an ideal means to measure the hardness (strength), modulus (stiffness), and critical scratch force (adhesion) of these critical films.