Kaleido Technology ApS
Kaleido Technology is a Danish manufacturer of OEM discrete and integrated micro-optical components and sub-systems for applications in telecom, sensor and material processing.
Two major problems have persistently haunted optical manufacturing over the last decade or so. The first problem is the lack of automation that characterizes manufacturing of optical components. The second problem is to realize components that will meet the often very strict requirements in terms of stability towards temperature, humidity and chemical conditions. Kaleido's approach is a technology that will solve both of these problems leading to cost-effective manufacturing of rugged and stable components and sub-modules.
Kaleido's technology is build from three key ingredients:
Kaleido Technology is a Danish manufacturer of OEM discrete and integrated micro-optical components and sub-systems for applications in telecom, sensor and material processing.
Two major problems have persistently haunted optical manufacturing over the last decade or so. The first problem is the lack of automation that characterizes manufacturing of optical components. The second problem is to realize components that will meet the often very strict requirements in terms of stability towards temperature, humidity and chemical conditions. Kaleido's approach is a technology that will solve both of these problems leading to cost-effective manufacturing of rugged and stable components and sub-modules.
Kaleido's technology is build from three key ingredients:
- volume precision molding of inorganic glasses and organic polymers,
- monolithic integration of complex optical surfaces,
- wafer-scale integration for production automation.
Precision molding, be it of glasses or polymers, provides a fast yet highly accurate way of replicating optical structures in large quantities compared to other methods such as direct polishing. By further integrating multiple optical structures in a single molded unit and using free-form surfaces as a replacement of spherical surface it is possible to increase performance and at the same time reduce component size. In addition, this monolithic integration will take complexity out of the manual assembly step in traditional pick-and-place systems and bring the complexity to the process step of manufacturing the mold die.