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CLM-3D - DualBeam  

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The CLM-3D delivers three-dimensional metrology information to meet the rapid prototyping and process control needs of modern semiconductor manufacturers. Combining an electron...
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ExSolve Wafer TEM Prep  

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The ExSolve WTP system is an automated, high-throughput sample preparation system that can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300mm in diameter. It is part...
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FEI® Fibermetric™ System  

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Your Solution for Faster, Better, Easier Fiber Analysis Now, direct observation and measurement of micro- and nano-fibers will be faster, better and easier than ever before with the new...
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