Leica EM TIC 3X Ion Beam Milling System by Leica Microsystems

The Triple Ion Beam Cutter, Leica EM TIC 3X allows production of cross sections of hard/soft, porous, heat sensitive, brittle and heterogeneous material for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.

Leica EM TIC 3X Ion Beam Milling System

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Efficiency and flexibility

The Triple Ion Beam Cutter, Leica EM TIC 3X allows the production of cross-sections of hard/soft, porous, heat-sensitive, brittle, and heterogeneous material for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations. Three ion beams (individually controlled), cooling stage and multiple sample stage ensure milling at high rates, cutting broad and deep into the sample resulting in high-quality cross-sections. With the EM TIC 3X you achieve high-quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near-native state as possible.

The doubled ion milling rate of the latest EM TIC 3X can be further enhanced with the option of five different stages adapted to your application requirements.