ExSolve Wafer TEM Prep by FEI Company

The ExSolve WTP system is an automated, high-throughput sample preparation system that can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300mm in diameter. It is part of a fast, complete workflow that includes TEMLink™, and the Metrios™ TEM. The ExSolve includes FOUP handling and is designed to be located in the fab near the manufacturing line.

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ExSolve Wafer TEM Prep

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The ExSolve WTP system is an automated, high-throughput sample preparation system that can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300mm in diameter.

It is part of a fast, complete workflow that includes TEMLink™, and the Metrios™ TEM. The ExSolve includes FOUP handling and is designed to be located in the fab near the manufacturing line.

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