FTIR Microscopy and Imaging for Failure Analysis in Electronics Manufacturing
6 March 2013
The electronics industry relies heavily on failure analysis (FA) to maximize productivity and to minimize downtime. Traditionally, FA has revolved around indirect methods that attempt to use changes in system function to elucidate deficiencies in the manufacturing process or, more recently, electron microscopy to help identify the atomic composition of contaminants observed on a given analytical sample. This application note demonstrates how the combination of FTIR microscopy, imaging, and spectral libraries for identification provides a straightforward path to rapidly and efficiently resolve FA issues and to increase productivity in the manufacturing process.